含铜废水预处理设施脱氮升级改造工程

为了减轻太湖保护区范围内企业处理废水的负担,苏州白荡污水处理厂利用其含铜废水预处理设施的富余处理能力处理某公司产生的含氮废水。针对含氮废水高NO3^--N和低碳氮比等特点,在充分利用原处理设施的基础上,采用"A/O+固定床生物膜工艺+高效脱氮填料+乙酸钠碳源+内回流"组合工艺对含铜废水预处理设施进行脱氮升级改造。改造后实际运行结果表明,设施运行稳定,出水水质达到出水水质达到设计出水要求,TN和NH4^+-N的去除率分别达到85.4%和82.3%,Cu的去除率提高了17.6%。     

高压辊磨+搅拌磨在某复杂难选铁矿石选别工艺中的优越性研究

为了验证在某复杂难选铁矿石的选矿工艺中，应用高压辊磨机和立式搅拌磨的优越性，进行了一系列对比试验。结果表明，与颚式破碎机相比，高压辊磨机产品的粉矿率更高，产品的可磨性更好；与球磨机相比，立式搅拌磨机细磨效率更高、效果更好，相同磨矿细度下，立式搅拌磨机磨矿产品的解离度更高，磁选铁精矿品位也更高；高压辊磨+立式搅拌磨在处理复杂难选铁矿石方面具有显著的优势。     

某贫磁赤铁矿石选矿工艺试验研究

为了使某矿山贫磁赤铁矿资源得到合理的开发利用，针对现开采部位矿石的性质和可选性问题，进行了工艺矿物学和可选性试验研究。试验结果表明：采用弱磁、强磁—阴离子反浮选工艺可得到精矿铁品位68.55%、精矿产率36.41%、金属回收率79.92%、尾矿品位9.86%的较好选别指标，说明矿石的可选性较好，为该矿石的合理开发利用提供了可靠的技术依据。     

Coupling in situ experiments and modeling – Opportunities for data fusion,machine learning,and discovery of emergent behavior

This paper reviews recent studies, that not only includes both experiments and modeling components, but celebrates a close coupling between these techniques, in order to provide insights into the plasticity and failure of polycrystalline metals. Examples are provided of studies across multiple-scales, including, but not limited to, density functional theory combined with atom probe tomography, molecular dynamics combined with in situ transmission electron miscopy, discrete dislocation dynamics combined with nanopillars experiments, crystal plasticity combined with digital image correlation, and crystal plasticity combined with in situ high energy X-ray diffraction. The close synergy between in situ experiments and modeling provides new opportunities for model calibration, verification, and validation, by providing direct means of comparison, thus removing aspects of epistemic uncertainty in the approach. Further, data fusion between in situ experimental and model-based data, along with data driven approaches, provides a paradigm shift for determining the emergent behavior of deformation and failure, which is the foundation that underpins the mechanical behavior of polycrystalline materials.     

一种计算空间异面高压线间最短距离的方法

在电力工程建设、运行、管理中,需要遵循许多行业规范,尤其是高压线间的间距,关系到电网运行的安全与否。对于一些容易判断两线间最短距离的高压线,如平行的高压线等,可以方便的求出其最短距离,但是,在遇到一些不易判断出两线间最短距离位置的高压线时,需要通过一定的方法求出两高压线间的最短距离,以判断是否符合规范要求,确保电网的安全运行。本文提出一种利用Mathematica软件计算空间异面高压线间最短距离的方法。     

ICP-OES测定西藏铜矿浸出液中铜铅锌等8种矿物组分

电感耦合等离子体光谱法测定西藏铜矿浸出液中8种矿物组分,讨论了元素分析谱线选择、背景校正等因素。结果表明,在高海拔地区仪器参数优化条件下,元素间也没有干扰且该方法快速,准确可靠,各元素检出限5.6~42μg·m L-1之间,加标回收率为92.5%~106%,相对标准偏差RSD均小于1.0%,适用于高海拔条件下对铜矿浸出液的日常检测。     

高精度多环片自动装配控制技术

为了实现对微小环片零件的自动化装配,搭建了自动装配系统.通过4根直线导向轴与4个直线轴承来提高系统的导向精度和刚度.采用直线导轨进行各装配作业模块之间的切换,保证了微小环片零件的自动装配与取出.在环片的装配方向上,螺旋升降机和光栅尺实现环片的位置精度控制.在Lab VIEW编程环境中,采用分层软件架构和模块化控制思想,避免了不必要的数据循环检测与丢失,能够达到环片组件的装配精度要求.控制系统分为系统初始化模块、参数设置模块、装配模块和取出模块,自动装配系统通过各个模块间的相互交流配合完成装配任务.采用本文中自动装配系统装配环片的实验结果表明,环片零件装配的最大位置误差为26μm,垂直度误差为17μm,平均装配时间为75 s/片,可满足环片组件所需的精度要求.     

Electrical Breakdown Properties and Space Charge Formation in High Temperature Region in Ultraviolet Ray Irradiated PVC

Polyvinyl chloride (PVC) is the most popular insulating material for electric wiring instruments. However, an exothermic reaction above 150 °C may cause deterioration of the insulating properties of PVC. Therefore, it is important to clarify the heat degradation in PVC, not only to investigate the ignition of electrical wiring products but also to use electrical products safely. It is known that ultraviolet (UV) irradiation causes chemical deterioration of PVC and an increase in its conductivity. Generally, it has been thought that the electrical breakdown properties, electrical conduction, and insulating performance are affected by space charge accumulation in an insulating material. A high temperature pulsed electroacoustic (PEA) system usable up to 250 °C has been developed, and the PEA system can measure the space charge distribution and conduction current in the high temperature range simultaneously. In this investigation, the space charge distribution and conduction current were measured up to electrical breakdown in a non‐UV irradiated sample (normal PVC) and in 353 nm and 253 nm UV‐irradiated PVC samples in the range from room temperature to 200 °C in a DC electric field. In the short wavelength UV irradiated PVC sample (253 nm, 300 h), a deterioration of breakdown strength at 90 °C to 150 °C and negative packet‐like charges were observed at 60 °C and 100 °C, a positive charge accumulated in front of both the anode and cathode above 90 °C, and a higher electric field near the cathode side because the positive charge of the cathode side was greater.     

适应于自动驾驶的计算结构与平台综述

信息与通信技术领域的不断发展,推动了自动驾驶汽车的巨大进步。自动驾驶汽车有效解决了用户对出行日益提高的安全、便捷、舒适、高效等个性化需求,有着巨大的商业前景和应用价值。首先从自动驾驶的定义出发,对自动驾驶汽车计算任务进行了分类总结,阐述了自动驾驶汽车集移动端、边缘节点和云端一体的计算结构。然后分类讨论了目前自动驾驶汽车移动端计算平台,呈现出异构多核的特点,并对当前主流的底层计算平台进行了对比分析。最后,从性能与成本和信息安全两个方面总结目前自动驾驶汽车计算结构和平台遇到的问题与挑战。     

High-Tg porous polyimide films with low dielectric constant derived from spiro-(adamantane-2,9′(2′,7′-diamino)-fluorene)

Porous polyimide (PI) films with low dielectric constants and excellent thermal properties have been a pressing demand for the next generation of high-performance, miniature, and ultrathin microelectronic devices. A series of novel porous PI films containing fluorenyl-adamantane groups were prepared successfully via thermolysis of poly(ethylene glycol) (PEG) added in the PI matrix. The cross-sectional morphologies of porous PI films showed closed pores with diameters ranging from 135 to 158 nm, which were uniform and regular in shape without interconnectivity. These porous PI films exhibited excellent thermal properties with a glass-transition temperature at 376 °C whereas the 5% weight loss temperature in air excess of 405 °C due to enhanced rigidity afforded by fluorenyl-adamantane groups. Accompanied by thermolysis content of PEG increasing from 0 to 20 wt %, the density of porous PI films decreased, and the corresponding porosity grew significantly from 0 to 11.48%. Depending on porosity, the dielectric constant and dielectric loss of porous PI films significantly declined from 2.89 to 2.37 and from 0.050 to 0.021, respectively. These excellent properties benefit the as-prepared porous PI films for application as interlayer dielectrics, integrated circuit chips, or multichip modules in microelectronic fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47313.